Abstract— In this paper a method for TCAD evaluation of RF-Power transistors for high-efficiency operation using drain bias-modulation is presented. The method is based on large signal time-domain transient computational load-pull. With the method, intrinsic device parasitics and mechanisms affecting device efficiency under drain bias modulation can be investigated and optimized for the application making it very useful for RFIC design. A case study has been done on a CMOS compatible LDMOS. For verification under dynamic operation two-tone signals with varying envelope has been simulated. The results show a possible 15% increase in the efficiency of a modulated signal for the studied device at the expense of increased phase distortion observable also in the time-domain waveforms generated. Since the method is based on TCAD it is also useful in the investigation of e.g. dynamic breakdown during high envelope under bias-modulation operation.